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Product Description
A 2 mil electrical grade polyimide film with silicone adhesive.
Additional Information
Application | Protecting gold fingers from molten solder during hot air wave solder leveling process. |
Feature Benefits | Thin and conformable, outstanding tear and abrasion resistance, reduces clean-up time. Excellent resistance to acids, oils, solvents aging, staining, water immersion. |
Backing | Polyimide Film |
Adhesive | Silicone – Pressure Sensitive Adhesive System |
Total Thickness | 3.5 mils |
Colors | Amber |
Adhesion | 25 oz/in. |
Liner | n/a |
Temperature Resistance (F) | 500 degrees F |
Length (yds) | 36 |
Other widths available upon request? | Yes |
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